Suitable for single/double-sided films
- Fully automatic rapid production with robot arm.
- Lamination in a vacuum environment reduces significantly the residual gases at the laminating interface.
- Loading / Unloading cassette sufficiency.
- IR lamp heating function.
- Two screens for easy operations.
- Graphic presentation of important statistic data.
- User-friendly operation for manual wafer placement.
Technical Specification
| Dimensions |
3320 mm × 1100 mm × 2400 mm (WｘDｘＨ) |
| Weight |
2500 kg |
| AC power |
Working voltage 415(3phase) / 240(1phase) Volt.(V) |
|
Plant safe current 60 A |
| Air supply |
Air Pressure 0.8 MPa |
|
Air Tube Diameter Ø 12 mm |
| Wafer size |
6 inch |
| Chip size |
None |
| Laser cut depth |
None |
| Flat ring size |
- |
| Tape size |
180 ˜ 250 mm (W) x 100 M (L) |
| Carrier |
6 inches (Ø 150 mm), 6.5 inches (Ø 165 mm), 8 inches (Ø 200 mm) |
Features
| Vacuum |
Lamination in a vacuum environment reduces significantly the residual gases at the laminating interface. |
| IR lamp |
Optional IR lamp for heating depending on process needs. |
| Automatic |
Fully automatic rapid production. |
| Adhesive |
The adhesive membrane does the job for lamination. |
| Quick replacement |
Quick replacement of membrane and waste material reels. |
| Barcode reader |
For lamination, it can read barcode to record wafer information. |
| Applied evenly |
The laminating pressure is applied evenly. |
| Cut to fit shape |
For double-sided lamination, the film is cut to fit the required shape at the wafer laminating station according to the outer diameter of the wafer. |
| Aligner identify |
The combination of robotic arm and aligner helps identify the front and rear sides of the wafer and laminating film and flip them over if necessary and the work piece rotates to the correct laminating position automatically. |