Array Metallization Dipper

Array dipping of MLCC, MLCI, MLV, LTCC etc.

• Very accurate termination position
• Dipping resolution 1 micron
• Blotting function
• Anti airbubble function
• Capacity up to 50.000 pieces per hour
• Superior dipping results
• Diamond shaped holes with ± 15micron position accurac
• Fast heating and cooling during drying
• Lowest energy consumption
• Very low tooling cost

The unique Thin Array Carrier Plate with diamond shaped openings assures a high chip holding force with high centering accuracy. The thin carrier plate requires very low energy consumption during the drying process because of the low thickness and material choice. The drying process is therefore predominantly defined by the paste parameters.

Designed for dipping of array terminations on ceramic components The dedicated design assures a flexible dipping process with a high production capacity and high quality terminations. The programmable dipping parameters allow optimization of the paste deposition and reduction of defect terminations by unique anti air bubble removal functions.